In 2015, global IP traffic exceeded 1 zettabyte and is predicted to reach 3.3 zettabytes by 2021, which means 24% annual growth from 2016 to 2021. The rapid growth of connected devices and increasing bandwidth use require significant increases in the capacity of telecommunication networks and data center equipment connections. The zCD Interconnect System, Style 1 delivers cutting-edge technology, transmitting 400 Gbps data rates (25 Gbps per serial lane) with excellent signal integrity (SI), electromagnetic interference (EMI) protection and thermal cooling.

SFP+ and QSFP+ form factors are popular with data center and networking OEMs due to their ability to more than double front panel density. But future data rate needs will make these connectors obsolete. The zCD Interconnect System, conforming to the CDFP MSA, was conceived around the same form factors as SFP+ and QSFP+. But the zCD form factor will more than double the front panel density of QSFP+ while offering 400 Gbps data rates.

From 2012 to 2017, data center IP traffic grew by 25%. As a result, the data center/networking industry is driving to smaller, faster and lower-cost infrastructure. zCD enables the highest port and bandwidth density of any pluggable form factor currently on the market. For example, with a 0.75mm pitch and 400 Gbps per port, a 1U switch can deliver more than 5 Tbps.